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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Mitigation of deleterious effects of tin
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Cross References:
IEC/TS 62647-1:2012
IEC/PAS 62647-3
IEC/PAS 62647-21
IEC/PAS 62647-22
ANSI/GEIA-STD-0006
ANSI Z1.4
IPC J-STD-001
IPC-CC-830
JESD201
JESD213
MIL-STD-1580
IEC/TS 62239-1
IEC/PAS 62647-23
IPC-CC-830
MIL-I-46058C
JESD22-A121
All current amendments available at time of purchase are included with the purchase of this document. See more
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