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BS PD IEC TR 63378-1:2021
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  • BS PD IEC TR 63378-1:2021

BS PD IEC TR 63378-1:2021

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Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

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Full Description

This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

All current amendments available at time of purchase are included with the purchase of this document.

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